| Wafer Grinding全自動晶圓研磨GDM300 |
 |
價格： 元(人民幣) | 產(chǎn)地：本地 |
| 最少起訂量：1臺 | 發(fā)貨地：本地至全國 | |
| 上架時間：2019-11-13 12:52:18 | 瀏覽量：143 | |
上海衡鵬能源科技有限公司
 |
||
| 經(jīng)營模式：貿(mào)易公司 | 公司類型：其他有限責任公司 | |
| 所屬行業(yè)：儀器儀表加工設備 | 主要客戶：SMT,malcom,goot | |
 在線咨詢  |
||
| 聯(lián)系人:陳靜靜 (小姐) | 手機:15026865822 |
電話: |
傳真: |
| 郵箱:service@hapoin.com | 地址:上海市徐匯區(qū)田州路159號蓮花大廈3樓B座 |
|
Wafer Grinding全自動晶圓研磨GDM300 ——又稱晶圓拋光/晶圓背拋/晶圓減薄 Wafer Grinding全自動晶圓研磨GDM300概要： GDM300 Wafer Grinding is a fully automatic continuous downfeed grinding machine with dual polishing stations for increased throughput. Wafers are handled through the machine by a 6-axis robot, and load/unload arms designed for 25 um capability. An optional edge trimming system is recommended for eliminating edge chipping for thin wafers. Chuck speed, grinding wheel, and grind spindle downfeed rate speeds can be used to manipulate grinder throughput, surface finish, and wheel life. A two-point in-process gauge measuring system controls wafer thickness under grind spindles 1 and 2 with an optional laser detection for a more precision thickness accuracy (recommended for < 50 um). Programmable oscillating polish heads can be programmed to maintain wafer profile (ttv) in conjunction with with the optional motorized spindle angle adjustment. After completion at grind and polish, wafer is automatically transferred by robot to the mounter unit for UV exposure, detape, and mount. Pre-cut DAF feature is optional while single DAF is included. Coin-stack feature may be integrated. The local polishing unit removes subsurface damage for increased wafer die strength and the ability to handle final thickness of 25 microns. Wafer Grinding全自動晶圓研磨GDM300特長： ·The process from back grinding to wafer mounting continuously by fully automatic system, Which enable to grind till 25um thickness. ·With 2 head polishing stage, throughput is almost double compared with 1 polish head system. ·Built in edge trimming system is available as an option for thin wafer process. ·Dual index system, which polishing stage and grinding stage is completely separated, satisfy the cleanness required for TSV and MEMS process. ·Less than Ra1A ultra luminance, ultra mirror surface is possible. Wafer Grinding全自動晶圓研磨GDM300相關產(chǎn)品： 衡鵬供應 晶圓研磨/晶圓減薄/晶圓拋光/晶圓背拋/Wafer Grinding GNX200BP |
| 版權聲明：以上所展示的信息由會員自行提供，內(nèi)容的真實性、準確性和合法性由發(fā)布會員負責。機電之家對此不承擔任何責任。 友情提醒：為規(guī)避購買風險，建議您在購買相關產(chǎn)品前務必確認供應商資質(zhì)及產(chǎn)品質(zhì)量。 |
機電之家網(wǎng) - 機電行業(yè)權威網(wǎng)絡宣傳媒體
關于我們 | 聯(lián)系我們 | 廣告合作 | 付款方式 | 使用幫助 | 會員助手 | 免費鏈接Copyright 2011 jdzj.com All Rights Reserved技術支持：杭州濱興科技有限公司
銷售熱線：0571-28292387 
在線客服：0571-87774297
展會合作/友情連接：0571-87774298
網(wǎng)站服務咨詢：0571-28292385
投訴熱線：400-6680-889(分機7)
網(wǎng)站經(jīng)營許可證:浙B2-20080178
