| 晶圓研磨GNX200BP晶圓減薄Wafer Grinding |
 |
價(jià)格： 元(人民幣) | 產(chǎn)地：本地 |
| 最少起訂量：1臺(tái) | 發(fā)貨地：本地至全國(guó) | |
| 上架時(shí)間：2021-03-25 10:02:03 | 瀏覽量：139 | |
上海衡鵬實(shí)業(yè)有限公司
 |
||
| 經(jīng)營(yíng)模式： | 公司類型：其他有限責(zé)任公司 | |
| 所屬行業(yè)：專用儀器 | 主要客戶： | |
 在線咨詢  |
||
| 聯(lián)系人:陳靜靜 () | 手機(jī):18221665509 |
電話: |
傳真: |
| 郵箱:service@hapoin.com | 地址: |
|
晶圓研磨GNX200BP晶圓減薄Wafer Grinding 晶圓研磨GNX200BP晶圓減薄/Wafer Grinding概要 GNX200BP Wafer Grinding is a fully automatic continuous downfeed grinding machine. Wafers are handled through the machine by a robot, and load/unload arms. Two different stations are used for wafer cleaning after the final grind station. Chuck speed, grinding wheel, and grind spindle downfeed rate speeds can be used to manipulate grinder throughput, surface finish, and wheel life. A two-point in-process gauge measuring system controls wafer thickness under grind spindles 1 and 2. A three-point grind spindle angle adjustment mechanism is utilized for easily maintaining wafer profile (ttv); with the option a motorized adjustment. After completion at the grind station, the wafer transfers to Polish unit automatically. The local polishing unit removes subsurface damage for increased wafer die strength, and the ability to handle final thickness of 50 microns. 晶圓研磨GNX200BP晶圓減薄Wafer Grinding相關(guān)產(chǎn)品： 衡鵬供應(yīng) GDM300晶圓研磨/晶圓減薄/晶圓拋光/晶圓背拋/Wafer Grinding |
| 版權(quán)聲明：以上所展示的信息由會(huì)員自行提供，內(nèi)容的真實(shí)性、準(zhǔn)確性和合法性由發(fā)布會(huì)員負(fù)責(zé)。機(jī)電之家對(duì)此不承擔(dān)任何責(zé)任。 友情提醒：為規(guī)避購(gòu)買風(fēng)險(xiǎn)，建議您在購(gòu)買相關(guān)產(chǎn)品前務(wù)必確認(rèn)供應(yīng)商資質(zhì)及產(chǎn)品質(zhì)量。 |
機(jī)電之家網(wǎng) - 機(jī)電行業(yè)權(quán)威網(wǎng)絡(luò)宣傳媒體
關(guān)于我們 | 聯(lián)系我們 | 廣告合作 | 付款方式 | 使用幫助 | 會(huì)員助手 | 免費(fèi)鏈接Copyright 2011 jdzj.com All Rights Reserved技術(shù)支持：杭州濱興科技有限公司
銷售熱線：0571-28292387 
在線客服：0571-87774297
展會(huì)合作/友情連接：0571-87774298
網(wǎng)站服務(wù)咨詢：0571-28292385
投訴熱線：400-6680-889(分機(jī)7)
網(wǎng)站經(jīng)營(yíng)許可證:浙B2-20080178
